Developed products
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High thermal conductivity/low elasticity resin substrate
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High frequency probe card
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Conductive Metal Fiber
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Flexible wiring
R&D policy
The best future
— Aiming for a goal that everyone can agree on
— Share your opinions and shape them
— Providing joy and value to customers
A bright future for everyone involved!

Research and Development vision
We regard our products as rough stones for providing special value,
by repeatedly pioneering new areas, we will shift to electronic devices.
In addition, we are actively working to build an environment-friendly and appropriate working environment.
We aim to contribute to a sustainable future that exceeds the expectations of all stakeholders!

Solutions provided by TOTOKU
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Semiconductor field
Continuous narrowing of product pitch
Miniaturization including peripheral parts -
Mobility
Improved heat resistance, withstand voltage performance, and miniaturization
Thermal control on a local basis -
Communication field
Reduced signal loss during high-speed communication
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Consumer equipment
Rapid response to improvement cycle
Cooperation system
With three collaboration systems
aiming to achieve the R&D vision
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Internal collaboration
Technical
By tackling common issues, we are working to accelerate development speed and streamline operations. -
Affiliated company collaboration
We will promote technology fusion and development of items for overseas by bringing together technologies with domestic and overseas subsidiaries and affiliates.
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Industry-academia collaboration
We are working on joint research with universities and AIST in order to increase opportunities for technological breakthroughs, unitization, and idea creation.
Proprietary technology
Registered patent
Patent registrations have been steadily increasing since 2019, and as of the end of 2022, 104 patents have been registered in Japan.
In the future, based on the development vision introduced above, we will not only deepen existing businesses, but also develop new businesses.
We will expand intellectual property rights in a wide area while conducting searches for

Main equipment
- Scanning electron microscope (SEM)
- Thermal analysis equipment (DTA, DSC, TG, TMA)
- Precision universal testing machine (tensile, compression, peel, coefficient of friction)
- Spiral sliding bending tester
- Thermal shock device
- Kneading/extrusion test equipment
- Single axis alignment winding machine
- 2-drum type die dynamic characteristic measurement wire drawing machine
- Digital oscilloscope with TDR module
- Arbitrary signal generator for 53Gbaud
- CST STUDIO SUITE (Electromagnetic field analysis software)
- ANSYS CFD Premium
(thermal fluid analysis software)
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By kneading/extrusion test equipment
Development of new resin materials -
Optimal for narrowing down wire drawing conditions
Dynamic characteristic measurement wire drawing machine -
Using ANSYS CFD Premium
coaxial cable assembly
Heat generation prediction analysis screen